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Book：Semiconductor Processes and Integration

Author: Professor Yung-Chun Wu (吳永俊教授)

Publisher: Cengage; 1st ed. 2026 edition, Softcover: 496 pages

ISBN 978-6267533420

https://www.cengageasia.com/title/default/detail?isbn=9786267533420

The value of this book lies in its direct focus on actual mass production technologies since 2010, and it greatly bridges the knowledge gap between fundamental physics and advanced 3D component manufacturing processes. This book is not only a textbook for many university electrical engineering and materials science departments, but also a crucial reference book for semiconductor engineers entering the workforce.

書名：半導體製程與整合 !!!半導體製程書籍銷售第一名!!!

作者：吳永俊(Yung-Chun Wu), 孫崇哲(Chong-Jhe Sun), 顏孝丞(Siao-Cheng Yan)

ISBN 978-626-9729-166

出版資訊：2023年8月, 滄海圖書資訊

本書在台灣半導體學術界與產業人才培訓中具有重要地位，在現代半導體學界與前瞻研發領域具有極高的指標性與重要性。有別於許多早期側重於單一基礎模組（如傳統微影、蝕刻）的教科書，本書的價值在於它直接切入 2010 年以後的實際量產技術，並極大程度地填補了基礎物理與先進三維元件製程之間的知識斷層。這本書不僅是許多大學電機、材料相關系所的教科書，更是半導體工程師進入職場後的關鍵工具書。